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DATA SHEET
Solid State Relay OCMOS FET
PS7221A-2A
8-PIN SOP, 260 V BREAK DOWN VOLTAGE 2-ch Optical Coupled MOS FET
DESCRIPTION
The PS7221A-2A is a solid state relay containing GaAs LEDs on the light emitting side (input side) and MOS FETs on the output side. It is suitable for analog signal control because of its low offset and high linearity.
FEATURES
* 2 channel type (1 a + 1 a output) * Low LED operating current (IF = 1 mA) * Designed for AC/DC switching line changer * Small and thin package (8-pin SOP, Height = 2.1 mm) * Low offset voltage * Ordering number of taping product: PS7221A-2A-F3, F4
APPLICATIONS
* Exchange equipment (FAX, MODEM, OCU + SLIC, etc.) * Measurement equipment * FA/OA equipment
The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version.
Not all devices/types available in every country. Please check with local NEC representative for availability and additional information.
Document No. P14400EJ2V0DS00 (2nd edition) Date Published June 2000 NS CP (K) Printed in Japan
The mark * shows major revised points.
(c)
1999, 2000
PS7221A-2A
PACKAGE DIMENSIONS
(in millimeters)
0.40.3
9.080.5
TOP VIEW
8 7 6 5 1. LED Anode 2. LED Cathode 3. LED Anode 4. LED Cathode 5. MOS FET 6. MOS FET 7. MOS FET 8. MOS FET
1
2
3 7.00.3 4.4
4
2.05+0.08 -0.05
0.15+0.10 -0.05
0.05+0.08 -0.05
2.54 0.40+0.10 -0.05 0.25 M
0.50.3
2
Data Sheet P14400EJ2V0DS00
PS7221A-2A
ORDERING INFORMATION
Part Number PS7221A-2A PS7221A-2A -F3 PS7221A-2A -F4 Package 8-pin SOP Packing Style Magazine case 45 pcs Embossed Tape 1 500 pcs/reel Application Part Number PS7221A-2A
*1
*1 For the application of the Safety Standard, following part number should be used.
ABSOLUTE MAXIMUM RATINGS (TA = 25 C, unless otherwise specified)
Parameter Diode Forward Current (DC) Reverse Voltage Power Dissipation Peak Forward Current MOS FET Break Down Voltage Continuous Load Current Pulse Load Current
*2 *1
Symbol IF VR PD IFP VL IL ILP
Ratings 50 5.0 50 1 260 170 300
Unit mA V mW/ch A V mA mA
(AC/DC Connection) Power Dissipation Isolation Voltage
*3
PD BV PT TA Tstg
180 1 500 460 -40 to +80 -40 to +100
mW/ch Vr.m.s. mW C C
Total Power Dissipation Operating Ambient Temperature Storage Temperature
*1 PW = 100 s, Duty Cycle = 1 % *2 PW = 100 ms, 1 shot *3 AC voltage for 1 minute at TA = 25 C, RH = 60 % between input and output
Data Sheet P14400EJ2V0DS00
3
PS7221A-2A
RECOMMENDED OPERATING CONDITIONS (TA = 25 C)
Parameter LED Operating Current LED Off Voltage Symbol IF VF MIN. 1 0 TYP. 10 MAX. 20 0.5 Unit mA V
ELECTRICAL CHARACTERISTICS (TA = 25 C)
Parameter Diode Forward Voltage Reverse Current MOS FET Off-state Leakage Current Output Capacitance Coupled LED On-state Current On-state Resistance Turn-on Time Turn-off Time
*1
Symbol VF IR ILoff Cout IFon Ron ton toff RI-O CI-O IF = 5 mA VR = 5 V VD = 260 V
Conditions
MIN.
TYP. 1.1
MAX. 1.4 5.0 1.0
Unit V
A A
pF/ch
VD = 0 V, f = 1 MHz IL = 170 mA IF = 10 mA, IL = 10 mA IF = 10 mA, VO = 5 V, RL = 500 , PW 10 ms VI-O = 1.0 kVDC V = 0 V, f = 1 MHz 10
9
122 1.0 3.4 0.4 0.03 10 1.0 0.2
mA ms
*1
Isolation Resistance Isolation Capacitance
0.4 pF/ch
*1 Test Circuit for Switching Time
IF Pulse Input VL
Input 50 % 0
VO = 5 V
Input monitor Rin RL
VO monitor
Output
90 %
10 % ton toff
4
Data Sheet P14400EJ2V0DS00
PS7221A-2A
TYPICAL CHARACTERISTICS (TA = 25 C, unless otherwise specified)
MAXIMUM FORWARD CURRENT vs. AMBIENT TEMPERATURE
100
Maximum Forward Current IF (mA) Maximum Load Current IL (mA)
MAXIMUM LOAD CURRENT vs. AMBIENT TEMPERATURE
300 250 200 150 100 50 0 -25
80
60
40
20 0 -25
0
25
50
7580
100
0
25
50
7580
100
Ambient Temperature TA (C)
Ambient Temperature TA (C)
FORWARD VOLTAGE vs. AMBIENT TEMPERATURE
1.6
Output Capacitance Cout (pF)
OUTPUT CAPACITANCE vs. APPLIED VOLTAGE
250 f = 1 MHz
Forward Voltage VF (V)
1.4 IF = 50 mA 1.2 30 mA 20 mA 10 mA 5 mA 1 mA
200
150
100
1.0
50
0.8 -25
0
25
50
75
100
0
10
20
30
40
50
60
Ambient Temperature TA (C)
Applied Voltage VD (V)
OFF-STATE LEAKAGE CURRENT vs. AMBIENT TEMPERATURE
10-6
Off-state Leakage Current ILoff (A)
LOAD CURRENT vs. LOAD VOLTAGE
200
VD = 260 V 10-7
Load Current IL (mA)
IF = 10 mA
100
10-8
10-9 10-10
-1.0
-0.5 -100
0
0.5
1.0
-200
10
-11
0
20
40
60
80 Load Voltage VL (V)
Ambient Temperature TA (C)
Data Sheet P14400EJ2V0DS00
5
PS7221A-2A
NORMALIZED ON-STATE RESISTANCE vs. AMBIENT TEMPERATURE
3.0
Normalized On-state Resistance Ron
ON-STATE RESISTANCE DISTRIBUTION
30 n = 50 pcs, IF = 10 mA, IL = 10 mA
2.5 2.0 1.5 1.0 0.5 0.0 -25
Normalized to 1.0 at TA = 25 C, IF = 10 mA, IL = 10 mA
Number (pcs)
25 20 15 10 5 0
0
25
50
75
100
3.0
3.2
3.4
3.6
3.8
Ambient Temperature TA (C)
On-state Resistance Ron ()
TURN-ON TIME vs. FORWARD CURRENT
2.5 VO = 5 V, RL = 500
Turn-on Time ton (ms) Turn-off Time toff (ms)
TURN-OFF TIME vs. FORWARD CURRENT
0.25 VO = 5 V, RL = 500 0.20
2.0
1.5
0.15
1.0
0.10
0.5
0.05
0
5
10
15
20
25
30
0
5
10
15
20
25
30
Forward Current IF (mA)
Forward Current IF (mA)
TURN-ON TIME DISTRIBUTION
30 25
Number (pcs)
TURN-OFF TIME DISTRIBUTION
30 n = 50 pcs, IF = 10 mA, VO = 5 V, RL = 500
n = 50 pcs, IF = 10 mA, VO = 5 V, RL = 500
Number (pcs)
25 20 15 10 5 0
20 15 10 5 0
0.3
0.4 Turn-on Time ton (ms)
0.5
0.02
0.04
Turn-off Time toff (ms)
6
Data Sheet P14400EJ2V0DS00
PS7221A-2A
NORMALIZED TURN-ON TIME vs. AMBIENT TEMPERATURE
3.0
Normalized Turn-on Time ton
NORMALIZED TURN-OFF TIME vs. AMBIENT TEMPERATURE
3.0
Normalized Turn-off Time toff
2.5 2.0 1.5 1.0 0.5 0.0 -25
Normalized to 1.0 at TA = 25 C, IF = 10 mA, VO = 5 V, RL = 500
2.5 2.0 1.5 1.0 0.5 0.0 -25
Normalized to 1.0 at TA = 25 C, IF = 10 mA, VO = 5 V, RL = 500
0
25
50
75
100
0
25
50
75
100
Ambient Temperature TA (C)
Ambient Temperature TA (C)
Remark The graphs indicate nominal characteristics.
Data Sheet P14400EJ2V0DS00
7
PS7221A-2A
TAPING SPECIFICATIONS (in millimeters)
Outline and Dimensions (Tape)
2.00.1 4.00.1
1.750.1
1.550.1
2.80.1
7.50.1
16.00.3
1.550.1 12.00.1
7.60.1
0.3
Tape Direction
PS7221A-2A-F3 PS7221A-2A-F4
Outline and Dimensions (Reel)
2.5
21.00.8
1005.0
330
2.00.5
13.01.0
10.450.1
16.4 +2.0 -0.0
Packing: 1 500 pcs/reel
8
Data Sheet P14400EJ2V0DS00
PS7221A-2A
RECOMMENDED SOLDERING CONDITIONS
(1) Infrared reflow soldering * Peak reflow temperature * Time of temperature higher than 210 C * Number of reflows * Flux 235 C or below (package surface temperature) 30 seconds or less Two Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of 0.2 Wt % is recommended.)
Recommended Temperature Profile of Infrared Reflow
Package Surface Temperature T (C)
(heating) to 10 s 235 C (peak temperature) 210 C to 30 s 100 to 160 C 60 to 120 s (preheating)
Time (s)
(2) Dip soldering * Temperature * Time * Number of times * Flux 260 C or below (molten solder temperature) 10 seconds or less One Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of 0.2 Wt % is recommended.) (3) Cautions * Fluxes Avoid removing the residual flux with freon-based and chlorine-based cleaning solvent. * Avoid shorting between portion of frame and leads.

: Portion of frame
Data Sheet P14400EJ2V0DS00
9
PS7221A-2A
[MEMO]
10
Data Sheet P14400EJ2V0DS00
PS7221A-2A
[MEMO]
Data Sheet P14400EJ2V0DS00
11
PS7221A-2A
CAUTION
Within this device there exists GaAs (Gallium Arsenide) material which is a harmful substance if ingested. Please do not under any circumstances break the hermetic seal.
* The information in this document is current as of June, 2000. The information is subject to change without notice. For actual design-in, refer to the latest publications of NEC's data sheets or data books, etc., for the most up-to-date specifications of NEC semiconductor products. Not all products and/or types are available in every country. Please check with an NEC sales representative for availability and additional information. * No part of this document may be copied or reproduced in any form or by any means without prior written consent of NEC. NEC assumes no responsibility for any errors that may appear in this document. * NEC does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of NEC semiconductor products listed in this document or any other liability arising from the use of such products. No license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC or others. * Descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software and information in the design of customer's equipment shall be done under the full responsibility of customer. NEC assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. * While NEC endeavours to enhance the quality, reliability and safety of NEC semiconductor products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize risks of damage to property or injury (including death) to persons arising from defects in NEC semiconductor products, customers must incorporate sufficient safety measures in their design, such as redundancy, fire-containment, and anti-failure features. * NEC semiconductor products are classified into the following three quality grades: "Standard", "Special" and "Specific". The "Specific" quality grade applies only to semiconductor products developed based on a customer-designated "quality assurance program" for a specific application. The recommended applications of a semiconductor product depend on its quality grade, as indicated below. Customers must check the quality grade of each semiconductor product before using it in a particular application. "Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots "Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) "Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems and medical equipment for life support, etc. The quality grade of NEC semiconductor products is "Standard" unless otherwise expressly specified in NEC's data sheets or data books, etc. If customers wish to use NEC semiconductor products in applications not intended by NEC, they must contact an NEC sales representative in advance to determine NEC's willingness to support a given application. (Note) (1) "NEC" as used in this statement means NEC Corporation and also includes its majority-owned subsidiaries. (2) "NEC semiconductor products" means any semiconductor product developed or manufactured by or for NEC (as defined above).
M8E 00. 4

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